Low head space packages are a common type of packaging used for a variety of products, including pharmaceuticals, medical devices, and food. These packages are designed to have a minimal amount of space between the product and the packaging material, which can help extend the shelf life of the product and protect it from contamination. Low head space packages are typically made of a flexible material, such as film or foil. The material is then sealed to the product, creating a tight seal that helps to preserve the product's integrity.
However, low head space packages can also be more susceptible to leaks, which can lead to sterility breaches, product spoilage and contamination. Therefore, it is important to ensure that these packages are properly sealed to prevent leaks and contamination. VeriPac 410 is a non-destructive seal and leak detection system that can help ensure the integrity of low head space packages.
Applications of low head space packages
Low head space packages are used in a variety of industries, including:
- Pharmaceutical industry: Low head space packages are used to package pharmaceuticals, such as tablets, capsules, and transdermal patches.
- Medical device industry: Low head space packages are used to package medical devices, such as, suture packaging.
- Personal care industry: Low head space packages are used to package personal care products, such as serums, lotions and creams packaged in sachets and pouches.
Low Head Space Package Inspection Using Force Decay Technology
Force Decay serves as a quantitative method for detecting leaks, especially in packaging with low headspace. The applicable packaging formats encompass non-porous materials, such as films, laminates, or foils. This method, being non-destructive, leaves the sample packages undamaged and unaltered. Following the completion of the test, the packages can seamlessly return to the batch without the need for disposal.
The testing system employs nested tooling to position the package consistently and restrict the unmeasured expansion of the package under examination. Initiating the test involves creating a vacuum in the test chamber, prompting the package to expand within it. Vacuum levels are continuously monitored throughout the test cycle, evaluating the package using the ASTM F2338 vacuum decay leak test method.
Multiple packages can undergo testing in a single test cycle, with the force decay measurement system discerning any defective packages. Defective packages exhibit a decay in the expansion force or vacuum level during the test cycle. The location of the defective package or cavity is then pinpointed. Force decay proves most effective when assessing multi-cavity package formats.
PTI’s VeriPac 410 inspection technique leverages force decay technology for non-destructive seal and leak detection in blister packs, sachets, and pouches with low headspace. VeriPac 410 functions as a vacuum based Container Closure Integrity test (CCIT) method, capable of testing multiple packages in a single test cycle. The force decay measurement system identifies any defective packages. This technology accurately measures force by observing the surface deflection of a package during a typical vacuum-based test cycle. The force measurement capability enables the VeriPac 410 series to pinpoint which package is defective while also conducting leak tests on packages with minimal headspace. Force decay remains the most effective technology, particularly in the assessment of multi-cavity package formats. This technology is scalable from the laboratory to automated inline inspection platforms.
Benefits of Force Decay leak testing
- Non-destructive and non-invasive
- Non-destructive, non-subjective, no sample preparation
- The test protocol is programmed into the testing unit with high degree of repeatability.
- Multiple packages can be tested in a single test cycle
- The test is operator independent and can be performed with minimal training
- Supports sustainable packaging initiatives
- Optimal solution for in-process testing
- Cost effective with rapid return on investment
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